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Multi-Die Laser Package

Multi-Die Laser Package for Projectors

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The Multi-Die Laser Package for Projectors

Unique 50W optical output power: the new laser module PLPM4 450 from OSRAM Opto Semiconductors greatly simplifies the construction of professional laser projectors. For the first time up to 20 blue laser chips have been packaged into a compact housing. In addition, the optical power of the individual chips has been doubled, thus achieving a total power of 50 watts and enabling projectors over 2,000 lumens of brightness with only one housing.

Advantages

Multi-Die Package will facilitate integration into projectors due to:

PLPM4 450 Multi-Die Laser Package

Assembly

Reduced assembly time due to handling of less components. Up to 20 laser chips are combined in a single package.

Optical Alignment

Complexity of optical alignment is dramatically reduced: Only a single sheet multi lens array is required for beam collimation.

Form factor

Multi-Die Package is a highly integrated package offering a unique small size.

Features

Butterfly package with 50 W optimal output power at Tcase 65°C
Up to 5 multimode laser chips in series connection bonded on 4 bars
Each bar can be operated individually
Wavelength: 450 nm +/- 10nm
Typ. wall plug efficiency of 35 % at 25° Tcase
ESD protection diode for each laser chip
Operation temperature: 10°C up to 70°C

Application Notes

more information

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